单词查询
damascene
美['dæməsi:n]，
释义
「
」
n. 镶嵌；金银线镶嵌工艺；大马士革人；西洋李子； v. (在金属上)用金银线镶嵌；使现波状花纹； adj. 大马士革的； 网络释义： 波形花纹镶嵌；金属镶嵌法；铜大马士革；
例句
No one is expecting Beijing's negotiators to undergo a Damascene conversion during the late nights of cajoling and compromise in Copenhagen.
没有人指望北京谈判代表在哥本哈根那充斥着利诱和妥协的深夜经历质的转变。
Cu electrodeposition is one of the most important technologies in the Damascene fabrication of interconnects.
铜电沉积是互连“大马士革”（Damascene）工艺中最为重要的技术之一。
The invention provides a method for forming a groove and a dual damascene structure.
本发明提出一种形成沟槽及双镶嵌结构的方法。
Damascene dealers boast what they describe as the most interesting collection of antique carpets and rugs this side of Persia.
大马士革的商人有着他们所说的最有趣的古老的波斯地毯。
"We have become citizens, when once we were sheep, " says a middle-class Damascene.
一名大马士革的中产阶级居民说：“过去我们是绵羊，现在我们才变成了公民。”
He cites a number of people who have undergone damascene conversions while listening to Mahler's music.
他列举了很多人因为听了马勒的音乐而改变了自己的信仰。
The protection plate (10) is formed within the first dielectric layer (14) using a damascene process.
保护板（10）利用镶嵌工艺在第一介质层（14）中形成。
When the plug and ILD are formed simultaneously, it is termed a dual damascene CMP.
当插件和ILD形成同时，它被称为双重镶嵌中医。
Figure 7. 10 indicates Cu wiring process by the dual damascene method.
John Damascene, On the Divine Images 1: 8.
没有人指望北京谈判代表在哥本哈根那充斥着利诱和妥协的深夜经历质的转变。
Cu electrodeposition is one of the most important technologies in the Damascene fabrication of interconnects.
铜电沉积是互连“大马士革”（Damascene）工艺中最为重要的技术之一。
The invention provides a method for forming a groove and a dual damascene structure.
本发明提出一种形成沟槽及双镶嵌结构的方法。
Damascene dealers boast what they describe as the most interesting collection of antique carpets and rugs this side of Persia.
大马士革的商人有着他们所说的最有趣的古老的波斯地毯。
"We have become citizens, when once we were sheep, " says a middle-class Damascene.
一名大马士革的中产阶级居民说：“过去我们是绵羊，现在我们才变成了公民。”
He cites a number of people who have undergone damascene conversions while listening to Mahler's music.
他列举了很多人因为听了马勒的音乐而改变了自己的信仰。
The protection plate (10) is formed within the first dielectric layer (14) using a damascene process.
保护板（10）利用镶嵌工艺在第一介质层（14）中形成。
When the plug and ILD are formed simultaneously, it is termed a dual damascene CMP.
当插件和ILD形成同时，它被称为双重镶嵌中医。
Figure 7. 10 indicates Cu wiring process by the dual damascene method.
John Damascene, On the Divine Images 1: 8.